{"id":3069,"date":"2023-12-18T12:48:47","date_gmt":"2023-12-18T12:48:47","guid":{"rendered":"https:\/\/mebstech.eu\/?page_id=3069"},"modified":"2024-06-23T11:44:41","modified_gmt":"2024-06-23T11:44:41","slug":"manufacturing-technology","status":"publish","type":"page","link":"https:\/\/mebstech.eu\/en\/manufacturing-technology\/","title":{"rendered":"MANUFACTURING & TECHNOLOGY"},"content":{"rendered":"

Manufacturing & Technology<\/h1><\/div><\/div><\/div><\/div><\/div>

Overview of the factory<\/h1><\/div>
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    Our team consists of over 500 employees with two manufacturing plants located in China. we have a combined manufacturing space of 110,000 m\u00b2 (1,180,000 ft\u00b2). In addition to our state-of-the-art production facilities, we have dedicated buildings for engineering and reliability labs, waste and water treatment, as well as employee living and recreational facilities.<\/p>\n<\/div><\/li>

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    Equipped with advanced machinery and equipment, we are capable of producing PCBs with up to 40 layers. Our manufacturing capabilities include cutting-edge technologies such as HDI, Stacked Microvias, Blind\/Buried Vias, and Low Dk\/Df Materials. These capabilities enable us to provide innovative solutions for various industries, including security and defense, industrial control, communication, medical instruments, and automotive electronics.<\/p>\n<\/div><\/li>

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    Our dedicated R&D team collaborates closely with customers and industry experts to develop and implement novel processes and materials. Through these collaborative efforts, we have garnered recognition and praise from clients worldwide.<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div>

    Rigid PCB Capabilities<\/h2><\/div><\/div><\/div>
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    \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Materials<\/th>\nFR4, High TG FR4, Halogen Free Material, CEM-3. Rogers HF Material, Aluminum<\/th>\n<\/tr>\n<\/thead>\n
    PTFE Laminates<\/td>\nRogers series, Taconic series, Arion series, Nelco series, Nelco series, Taizhou Wangling F4BK series, TP series<\/td>\n<\/tr>\n
    Hyrid Laminating<\/td>\nRogers\/Taconic\/Arion\/Nelco laminate with FR-4 material – including partical RO4350B hybrid laminating with FR-4<\/td>\n<\/tr>\n
    Layers<\/td>\n1 – 64 layers<\/td>\n<\/tr>\n
    Board Thickness<\/td>\n0.1 – 10 mm<\/td>\n<\/tr>\n
    Slodermask Type (LPI)<\/td>\nKuangshun, Taiyo, Himonia, Nanya, Onstatic, Chung Yu, MSDS<\/td>\n<\/tr>\n
    Soldermask Color<\/td>\nGreen, Yellow, Black, Blue, Red, White, Purple, Orange, Matte green, Matte blue, Matte black<\/td>\n<\/tr>\n
    Surface Treatment<\/td>\nHASL, HASL-LF, OSP, ENIG, ENEIPG, Hard gold, Gold finger<\/td>\n<\/tr>\n
    Min.Line \/ Track Width<\/td>\n3 mil<\/td>\n<\/tr>\n
    Min.Mechanical Drill Hole<\/td>\n0.10 mm<\/td>\n<\/tr>\n
    Min.Drilling Slot Size<\/td>\n0.6 mm<\/td>\n<\/tr>\n
    Copper Thickness<\/td>\n20 oz MAX<\/td>\n<\/tr>\n
    Legend \/ Silkscreen Color<\/td>\nBlack, White, Yellow and others<\/td>\n<\/tr>\n
    Other Technology<\/td>\nPeelable Mask, Carbon ink, Non-across Blindried Vias, Characteristic Impedance Control, VIA IN PAD, etc<\/td>\n<\/tr>\n
    HDI<\/td>\n1 + N + 1, 2+ N + 2, 3 + N + 3,  Anylayer HDI<\/td>\n<\/tr>\n
    Buried & Blind via<\/td>\n4 – 64 layers, 0.5 – 10 mm (Board Thickness)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div><\/div><\/div><\/div>

    Rigid-Flex PCB Capabilities<\/h2><\/div><\/div><\/div>
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    \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Flex & Rigid-Flex PCBs<\/th>\n1 -10 layers Flex PCB & 2 – 20 layers Rigid-flex PCBs<\/th>\n<\/tr>\n<\/thead>\n
    FCCL (adhesive)<\/td>\nShengyi SF305, PI = 1 mil and 2 mil, Cu = 0.33 oz & 0.5 oz & 1 oz
    \nPanasonic R-F5775(ER), PI = 1 mil and 2 mil, Cu = 0.33 oz & 0.5 oz & 1 oz
    \nDupont Pyralux AR PI = 1 mil and 2mil, Cu = 0.5 oz & 1 oz<\/td>\n<\/tr>\n
    Coverlay<\/td>\nShengyi SF305C & 0515 & 0525 &1025& 2030; Talflex FHK 1025 & 1035<\/td>\n<\/tr>\n
    NO FLOW PP<\/td>\nVentec: vt-47n(TG170) & em-285b(TG150)<\/td>\n<\/tr>\n
    CCL<\/td>\n ITEQ: IT180A
    Shengyi: S1000H & S1000-2
    Arlon: 85N
    Nelco: N4000-13 series<\/td>\n<\/tr>\n
    Board Thickness<\/td>\n0.3 – 3.0 mm <\/td>\n<\/tr>\n
    Board Size<\/td>\n10mm * 15mm Min
    406.4mm * 558.8mm Max<\/td>\n<\/tr>\n
    Min. BGA pad size<\/td>\n12mil (8mil for electrical soft gold board)<\/td>\n<\/tr>\n
    Surface Treatment<\/td>\nHASL, HASL-LF, ENIG, ENEPIG, Hard Gold, Immersion silver. Immersion tin, OSP<\/td>\n<\/tr>\n
    Bow & Twist<\/td>\n0.75% (symmetrical)<\/td>\n<\/tr>\n
    Other Techniques<\/td>\nHDI
    Gold Fingers
    Stiffener (Only for PI \/ FR4 Substrate)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div><\/div><\/div><\/div>

    HDI \uff08 High-Density Interconnect\uff09PCB Capabilities<\/h2><\/div><\/div><\/div>
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    \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
    Feature<\/th>\nCapacity<\/th>\n<\/tr>\n<\/thead>\n
    HDI PCB type:<\/td>\n1 + n + 1, 1 + 1 + n + 1 + 1, 2 + n + 2, 3 + n + 3 (n buried vias \u2264 0.3 mm)<\/td>\n<\/tr>\n
    Blind&buried via type:<\/td>\nmechanical blind & burried vias with less than 2 times laminating; Laser blind via<\/td>\n<\/tr>\n
    Min laser drilling size:<\/td>\n4 mil<\/td>\n<\/tr>\n
    Max laser drilling size:<\/td>\n6 mil<\/td>\n<\/tr>\n
    Finshed mechanical hole size:<\/td>\n5-244 mil (corresponding drilling tool size 8-248 mil)<\/td>\n<\/tr>\n
    Max aspect ratio for hole plate:<\/td>\n10 : 1<\/td>\n<\/tr>\n
    Max aspect ratio for laser via filling plating:<\/td>\n0.9 : 1 (Dpeth included copper thickness)<\/td>\n<\/tr>\n
    Min gap between hole wall and conductor (None blind and buried via PCB):<\/td>\n7 mil (\u22648L), 9 mil (10-14L), 10 mil( > 14L)<\/td>\n<\/tr>\n
    Min gap between hole wall conductor (Blind and buried via PCB):<\/td>\n8 mil (1 times laminating), 10mil (2 times laminating),  12 mil (3 times laminating)<\/td>\n<\/tr>\n
    Min gab between hole wall conductor (Laser blind hole buried via PCB):<\/td>\n7 mil  (1 + N + 1) ;  8 mil  (1 + 1 + N + 1 + 1 or 2 + N + 2)<\/td>\n<\/tr>\n
    Min space between laser holes and conductor:<\/td>\n6 mil<\/td>\n<\/tr>\n
    Min space between hole walls in different net:<\/td>\n10 mil<\/td>\n<\/tr>\n
    Min Pad size for laser drillings:<\/td>\n10mil (for 4 mil laser via), 11 mil(for 5 mil laser via)<\/td>\n<\/tr>\n
    Min Pad size for mechanical drillings:<\/td>\n16 mil (8 mil drillings)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div><\/div><\/div><\/div>

    The Different Types Of HDI PCB Structures<\/h2><\/div><\/div><\/div>

    With the capacity to produce HDI PCBs of up to 32 layer\uff0cdepending on the unique requirements of each project. Below is a table outlining the different types of HDI PCB structures we can create.<\/p>\n<\/div><\/div><\/div>

    \n
    \n\n\n\n\n\n\n\n\n\n
    HDI PCB Structures<\/th>\nThe Various categories of Micros Vias<\/th>\nLarge-Scale Production<\/th>\nSmall to Medium-Scale Production<\/th>\nPrototype<\/th>\nAvailable<\/th>\n<\/tr>\n<\/thead>\n
    1 + N + 1<\/td>\nBlind vias<\/td>\nYes<\/td>\nYes<\/td>\nYes<\/td>\nOver 4 layers<\/td>\n<\/tr>\n
    2 + N + 2<\/td>\nBlind\/Buried staggered vias<\/td>\nYes<\/td>\nYes<\/td>\nYes<\/td>\nOver 6 layers<\/td>\n<\/tr>\n
    2 + N + 2<\/td>\n Blind\/Buried stacked vias<\/td>\nYes<\/td>\nYes<\/td>\nYes<\/td>\nOver 6 layers<\/td>\n<\/tr>\n
    3 + N + 3<\/td>\n Blind\/Buried stacked vias<\/td>\n\/<\/td>\nYes<\/td>\nYes<\/td>\nOver 8 layers<\/td>\n<\/tr>\n
    3 + N + 3<\/td>\n Blind\/Buried stacked vias<\/td>\n\/<\/td>\n\/<\/td>\nYes<\/td>\nOver 8 layers<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div><\/div><\/div><\/div>

    Advanced Equipments Show<\/h2><\/div><\/div><\/div>
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    <\/span><\/div><\/div><\/div><\/div><\/div><\/p>","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"footnotes":""},"class_list":["post-3069","page","type-page","status-publish","hentry"],"featured_image_src":null,"featured_image_src_square":null,"jetpack_sharing_enabled":true,"_links":{"self":[{"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/pages\/3069","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/comments?post=3069"}],"version-history":[{"count":9,"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/pages\/3069\/revisions"}],"predecessor-version":[{"id":4077,"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/pages\/3069\/revisions\/4077"}],"wp:attachment":[{"href":"https:\/\/mebstech.eu\/en\/wp-json\/wp\/v2\/media?parent=3069"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}