Manufacturing & Technology

Overview of the factory

  • Our team consists of over 500 employees with two manufacturing plants located in China. we have a combined manufacturing space of 110,000 m² (1,180,000 ft²). In addition to our state-of-the-art production facilities, we have dedicated buildings for engineering and reliability labs, waste and water treatment, as well as employee living and recreational facilities.

  • Equipped with advanced machinery and equipment, we are capable of producing PCBs with up to 40 layers. Our manufacturing capabilities include cutting-edge technologies such as HDI, Stacked Microvias, Blind/Buried Vias, and Low Dk/Df Materials. These capabilities enable us to provide innovative solutions for various industries, including security and defense, industrial control, communication, medical instruments, and automotive electronics.

  • Our dedicated R&D team collaborates closely with customers and industry experts to develop and implement novel processes and materials. Through these collaborative efforts, we have garnered recognition and praise from clients worldwide.

Rigid PCB Capabilities

Materials FR4, High TG FR4, Halogen Free Material, CEM-3. Rogers HF Material, Aluminum
PTFE Laminates Rogers series, Taconic series, Arion series, Nelco series, Nelco series, Taizhou Wangling F4BK series, TP series
Hyrid Laminating Rogers/Taconic/Arion/Nelco laminate with FR-4 material – including partical RO4350B hybrid laminating with FR-4
Layers 1 – 64 layers
Board Thickness 0.1 – 10 mm
Slodermask Type (LPI) Kuangshun, Taiyo, Himonia, Nanya, Onstatic, Chung Yu, MSDS
Soldermask Color Green, Yellow, Black, Blue, Red, White, Purple, Orange, Matte green, Matte blue, Matte black
Surface Treatment HASL, HASL-LF, OSP, ENIG, ENEIPG, Hard gold, Gold finger
Min.Line / Track Width 3 mil
Min.Mechanical Drill Hole 0.10 mm
Min.Drilling Slot Size 0.6 mm
Copper Thickness 20 oz MAX
Legend / Silkscreen Color Black, White, Yellow and others
Other Technology Peelable Mask, Carbon ink, Non-across Blindried Vias, Characteristic Impedance Control, VIA IN PAD, etc
HDI 1 + N + 1, 2+ N + 2, 3 + N + 3,  Anylayer HDI
Buried & Blind via 4 – 64 layers, 0.5 – 10 mm (Board Thickness)

Rigid-Flex PCB Capabilities

Flex & Rigid-Flex PCBs 1 -10 layers Flex PCB & 2 – 20 layers Rigid-flex PCBs
FCCL (adhesive) Shengyi SF305, PI = 1 mil and 2 mil, Cu = 0.33 oz & 0.5 oz & 1 oz
Panasonic R-F5775(ER), PI = 1 mil and 2 mil, Cu = 0.33 oz & 0.5 oz & 1 oz
Dupont Pyralux AR PI = 1 mil and 2mil, Cu = 0.5 oz & 1 oz
Coverlay Shengyi SF305C & 0515 & 0525 &1025& 2030; Talflex FHK 1025 & 1035
NO FLOW PP Ventec: vt-47n(TG170) & em-285b(TG150)
CCL ITEQ: IT180A
Shengyi: S1000H & S1000-2
Arlon: 85N
Nelco: N4000-13 series
Board Thickness 0.3 – 3.0 mm
Board Size 10mm * 15mm Min
406.4mm * 558.8mm Max
Min. BGA pad size 12mil (8mil for electrical soft gold board)
Surface Treatment HASL, HASL-LF, ENIG, ENEPIG, Hard Gold, Immersion silver. Immersion tin, OSP
Bow & Twist 0.75% (symmetrical)
Other Techniques HDI
Gold Fingers
Stiffener (Only for PI / FR4 Substrate)

HDI （ High-Density Interconnect）PCB Capabilities

Feature Capacity
HDI PCB type: 1 + n + 1, 1 + 1 + n + 1 + 1, 2 + n + 2, 3 + n + 3 (n buried vias ≤ 0.3 mm)
Blind&buried via type: mechanical blind & burried vias with less than 2 times laminating; Laser blind via
Min laser drilling size: 4 mil
Max laser drilling size: 6 mil
Finshed mechanical hole size: 5-244 mil (corresponding drilling tool size 8-248 mil)
Max aspect ratio for hole plate: 10 : 1
Max aspect ratio for laser via filling plating: 0.9 : 1 (Dpeth included copper thickness)
Min gap between hole wall and conductor (None blind and buried via PCB): 7 mil (≤8L), 9 mil (10-14L), 10 mil( > 14L)
Min gap between hole wall conductor (Blind and buried via PCB): 8 mil (1 times laminating), 10mil (2 times laminating),  12 mil (3 times laminating)
Min gab between hole wall conductor (Laser blind hole buried via PCB): 7 mil  (1 + N + 1) ;  8 mil  (1 + 1 + N + 1 + 1 or 2 + N + 2)
Min space between laser holes and conductor: 6 mil
Min space between hole walls in different net: 10 mil
Min Pad size for laser drillings: 10mil (for 4 mil laser via), 11 mil(for 5 mil laser via)
Min Pad size for mechanical drillings: 16 mil (8 mil drillings)

The Different Types Of HDI PCB Structures

With the capacity to produce HDI PCBs of up to 32 layer，depending on the unique requirements of each project. Below is a table outlining the different types of HDI PCB structures we can create.

HDI PCB Structures The Various categories of Micros Vias Large-Scale Production Small to Medium-Scale Production Prototype Available
1 + N + 1 Blind vias Yes Yes Yes Over 4 layers
2 + N + 2 Blind/Buried staggered vias Yes Yes Yes Over 6 layers
2 + N + 2  Blind/Buried stacked vias Yes Yes Yes Over 6 layers
3 + N + 3  Blind/Buried stacked vias / Yes Yes Over 8 layers
3 + N + 3  Blind/Buried stacked vias / / Yes Over 8 layers

Advanced Equipments Show